- Low cost plasma etcher
- Upgradeable with load lock
- Upgradeable with turbopump
- SENTECH’s control software
- Up to 8" wafers and carriers
The RIE plasma etcher Etchlab 200 is a basic, cost effective tool for dry etch processes in a R&D environment. Its modular design offers a step by step upgrade of the pumping system, a load lock and a gas supply system to meet the requirements for challenging chemistries and tasks.
The Etchlab 200 is designed for modularity, process flexibility and simple use for all processes that are compatible with the wafer direct loading. Typical applications for the basic configuration are the etching of dielectrics (SiO2, Si3N4), semiconductors (Si), polymers and metals (Au, Pt, Ti, Ni).
| Technical Specifications |
| Reactor | 298 mm diameter, AlMgSi 0.5 material, hinged lid |
| Substrate electrode | water cooled aluminum electrode,
electrode diameter 215 mm,
4" – 8" wafers and carriers for pieces and smaller wafers |
| Upper electrode | hard coated aluminum with shower head and central window for optical endpoint detection |
| Vacuum system | anticorrosive backing pump, 16 m3/h, with CFS chemical filter and Fombline filled |
| Gas supply | 2 gas lines with MFC’s and cut off valve |
| RF power supply | 13.56 MHz RF generator, 600 W, air cooled |
| Control system | remote field controller, Interbus, basic interlocks realized by RFC |
| Software | SENTECH control software, including graphical interface, recipe control, powerful recipe editor and data logging |
Options:
- Vacuum loadlock
- Larger pumping system including turbopump,
- Additional gas lines for anticorrosive and corrosive gasses,
- Circulation chiller,
- Reactor heating,
- Etch depth and endpoint detection system (NanoMes),
- Optical emission monitor
Please contact us for more information.
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