Plasma Deposition and Etching

Mi-Net Technology is the UK distributor for Sentech GmbH of Germany. SENTECH Instruments develops, manufactures and sells advanced quality instrumentation for Plasma Process Technology (plasma etcher, plasma deposition systems). Please visit www.sentech.com for more information.

Plasma Deposition PECVD

Low stress, high rate, low temperature and low damage plasma enhanced chemical vapor deposition (PECVD)

SI 500 D - ICPECVD system for high plasma density
SI 500 PPD - PECVD parallel plate configuration with frequency mixing
Optical process monitoring

Plasma deposition of: SiO2, SiNx, SiOxNy, TEOS, a-Si:H, µ-Si:H, and DLC

Plasma Etching ICP-RIE and RIE

Low damage, high rate, temperature controlled plasma etching of MEMS, silicon, micro-optics, semiconductors, dielectrics, organic and metal films

ICP-RIE
SI 500
SI 500 C
SI 500-300

RIE
Etchlab 200
SI 591
SI 100

Cluster Configurations

Etch (ICP, RIE) modules, deposition modules (PECVD, ALD), cassette stations and productive robots can be combined to cluster systems for R&D and production to meet the requirements of closed processing and high throughput

Fully automated ICP and RIE etchers for compound semiconductor processing
Large area substrate processing for masks and micro-optics
High throughput chromium etch cluster

Cluster tool with etch and deposition modules
Small cluster tool with 3 process modules

Process Monitoring

Laser ellipsometry, interferometry and optical spectroscopy are offered for insitu and inline monitoring of film growth and erosion, etch depth measurement and endpoint control

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