Application Note - SiO2 Etching Selective to Photoresist Mask by SENTECH SI 500 ICP-RIE etching system


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Silicon dioxide (SiO2) is widely used in a wide variety of applications, including etching of holes such as via holes or contact holes, hard mask etching for the shallow trench isolation and gates, and also damascene etching. In fact, SiO2 has the largest number of process steps in device manufacturing among the etching technologies. Therefore, one of the important factors in SiO2 etching is the high selectivity to the resist mask. This application note presents a successful SiO2 ICP-RIE process result with a high selectivity to photoresist (PR) mask.

SiO2 Etching Selective to Photoresist Mask