Thin Film Processing


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Thin film processing tools from Mi-Net Technology utilise a range of complimentary techniques. These include well known techniques such as sputtering, evaporation, plasma etching and thin film deposition plus more. We can also help if you are looking for consumable materials such as sputtering targets, evaporation materials and substrates like silicon wafers or gallium nitride so please have a look through our product pages and contact us if you have any questions.


Physical Vapour Deposition

PVD techniques such as Magnetron Sputtering, Thermal Evaporation and other vacuum technologies. Solutions from small research tools to large industrial systems.


Plasma Deposition PECVD

PECVD systems with low stress, high rate, low temperature and low damage processes. All PECVD systems have the option of optical process monitoring which includes SENTECH's own thin film metrology tools.


Plasma Enhanced Atomic Layer Deposition PEALD

ALD systems enable both thermal and plasma assisted operation and deposition monitoring using SENTECH ellipsometers.


Plasma Eching ICP-RIE and RIE

ICP-RIE and RIE Plasma systems with low damage, high rate, temperature controlled plasma etching of MEMS, silicon, micro-optics, semiconductors, dielectrics, organic and metal films.


Cluster Configurations

Etching and deposition modules from Sentech Instruments can be combined with up to two cassette stations for high throughput processing of up to 200 mm wafers.