Thin Film Cluster Tools


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Thin Film Cluster Tools

SENTECH cluster tools comprise plasma etching and / or deposition modules, transfer chamber, and vacuum loadlock or cassette station. Transfer chambers including handling robot are available with three to six ports. Up to two cassette stations can be used to increase the throughput. The transfer chambers can be equipped with multiple options.

High Throughput

ICP-RIE plasma etching modules can be combined with two cassette stations for high throughput parallel processing of 200 mm wafers.

High Throughput Cluster Tool

Research and Development

Modules of ICP-RIE, RIE, PECVD, and ICPECVD can be combined with vacuum loadlock and / or cassette station to fulfill the special requirements of R & D.

Research and Development Cluster