The fully automated thin film quality control tool, SENTECH SENDURO accuva10 is a measurement tool for quality control in sensors, rf/power devices, SAW filters, and MEMS production. The tool provides reliable and precise measurement of thin film stacks, using spectroscopic reflectometry and ellipsometry. Wafers are loaded from standard cassettes and recipes carry out the quality control measurements. The tool is designed to measure film thicknesses, control deposition processes by measuring refractive indices of thin films, and prepare surface trimming for filters.

SENTECH Instruments of Berlin have been manufacturing tools for thin film metrology and thin film processing since 1990. They are a growing company with a reputation for high quality reliable equipment and excellent service. Their tools are used in applications such as semiconductors, microsystems, photovoltaics, nanotechnology and materials research.

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Key Features

  • Fully automated
  • Cassette loaded
  • Up to 200mm wafer mapping
  • Precise and repeatable measurements of film thickness, refractive index and extinction coefficient
  • Spectroscopic reflectometry and ellipsometry
  • Backside protection by edge grip technology allowing measurement of double-sided patterned wafers
  • Pattern recognition
  • SECS/GEM integration
  • Comprehensive thin film analysis software SpectraRay/4

Configurations

Spectroscopic Ellipsometer

  • Spot for mapping uniformity of test wafers
  • Mirco spots and pattern recognition for small fields of analysis
  • Extremely repeatable measurements with a high-precision spectroscopic ellipsometer, applying the most accurate Step Scan Analyser measurement mode, with no moving optical parts during data acquisition

Reflectometer

  • Smallest spot size for smallest fields of analysis
  • Fast measurement time for efficient mapping

Pattern Recognition

  • Fully automated pattern recognition for measuring in fields of analysis
  • Two-step pattern recognition of alignment marks and fields of analysis
  • Easy teaching of new patterns

Edge Grip

  • Minimum edge exclusion
  • Flexibility for multiple wafer sizes with quick change

Multiple Cassette Stations

  • 2 cassette/carrier stations with flexible carrier size
  • Automatic cassette/carrier detection: presents and size

SECS/GEM

  • Basic SECS/GEM integration with communication to MES
  • Advanced SECS/GEM integration including process program management and remote control by MES

If you need a quote or would like more information on this product then please get in touch

Other Products in Range

Other instruments in the SENTECH range of thin film metrology tools.

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