The SI500 plasma etcher delivers high quality low damage etching due to a unique Planar Triple Spiral Antenna (PTSA) source. The PTSA source generates homogenous plasma with high ion density and low ion energy.

User friendly software allows the users to work on a wide variety of substrates from wafer pieces to 200mm wafers. A special wafer handling system allow the user to quickly and easily switch wafer sizes with no need to pump down the tool and no need to make hardware changes within the tool.

Plasma etching can be configured to process a variety of materials including but not limited to III-V compound semiconductors, dielectrics, quartz, glass, silicon, silicon compounds, and metals.

Wafers can be single loaded through a load lock or cassette loaded. Cluster configurations are also possible.

SENTECH Instruments of Berlin have been manufacturing tools for thin film metrology and processing since 1990. They are a growing company with a reputation for high quality reliable equipment and excellent service. 

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Key Features

  • Low damage etching due to unique Planar Triple Spiral Antenna (PTSA) source
  • Low ion energy and narrow ion energy distribution
  • Dynamic temperature control with He backside cooling from -150°C to 400°C
  • Process wafer pieces up to full 200mm wafers
  • Special wafer handling system allows quick and easy switch between sample sizes without needing to open tool
  • High rate plasma etching with high aspect ratio easily performed using room temperature alternating processes or cryogenic processes
  • User friendly software

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