The SI500D plasma deposition tool delivers high quality low damage films due to a unique Planar Triple Spiral Antenna (PTSA) source. The PTSA source generates homogenous plasma with high ion density and low ion energy.
User friendly software allows the users to work on a wide variety of substrates from wafer pieces to 200mm wafers. A special wafer handling system allow the user to quickly and easily switch wafer sizes with no need to pump down the tool and make hardware changes within.
A low etch rate, high breakdown voltage, low stress, low damage to substrate and a very low interface state density down to deposition temperatures of less than 100°C produce outstanding film properties.
Wafers can be single loaded through a load lock or cassette loaded. Cluster configurations are also possible.
SENTECH Instruments of Berlin have been manufacturing tools for thin film metrology and processing since 1990. They are a growing company with a reputation for high quality reliable equipment and excellent service.
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